Chicago, IL, United States of America

Michael F Reardon

This inventor holds 2 USPTO granted patents. Top assignee: Wesley-Jessen Corporation. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael F Reardon. Retrieved from https://idiyas.com/inventor/michael-f-reardon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 1994

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2 patents (USPTO):Explore Patents

Title: Michael F. Reardon: Innovator from Chicago

Introduction

Michael F. Reardon is an accomplished inventor based in Chicago, Illinois. With a strong focus on innovative packaging solutions, he has made significant contributions to the industry and holds two patents to his name.

Latest Patents

Among his notable inventions is a blister package, reflecting his commitment to enhancing product protection and user convenience. This innovation showcases his ability to address market needs through practical design and functionality.

Career Highlights

Reardon has established a successful career at Wesley-Jessen Corporation, where his expertise in packaging and design plays a pivotal role. His work not only emphasizes quality craftsmanship but also the importance of innovation within the industry.

Collaborations

Throughout his career, Michael has collaborated with talented individuals such as Robert J. Kellar and Jeffrey D. Aulenbacher. These partnerships exemplify his dedication to teamwork and collective advancement in the field of packaging technology.

Conclusion

In summary, Michael F. Reardon stands out as a key innovator in the packaging industry. With his significant patents and collaborative spirit, he continues to shape the future of packaging solutions at Wesley-Jessen Corporation and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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