Backnang, Germany

Michael Eckstein

This inventor holds 4 USPTO granted patents. Top assignees: D&b Audiotechnik Gmbh, D&b Audiotechnik Gmbh & Co. Kg. Active years: 2018-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Eckstein. Retrieved from https://idiyas.com/inventor/michael-eckstein

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2018-2020

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4 patents (USPTO):Explore Patents

Title: The Innovations of Michael Eckstein

Introduction

Michael Eckstein is a notable inventor based in Backnang, Germany. He has made significant contributions to the field of audio technology, particularly in loudspeaker design. With a total of four patents to his name, Eckstein has established himself as a key figure in the industry.

Latest Patents

Among his latest innovations is a groundbreaking loudspeaker design. This patent showcases his commitment to enhancing audio quality and performance. His work continues to influence the way sound is delivered in various applications.

Career Highlights

Eckstein has had a distinguished career, working with prominent companies such as d&b audiotechnik GmbH and d&b audiotechnik GmbH & Co. KG. His experience in these organizations has allowed him to refine his skills and contribute to the development of advanced audio solutions.

Collaborations

Throughout his career, Eckstein has collaborated with talented individuals, including Fritz Wurster and Matthias Christner. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Michael Eckstein's contributions to audio technology through his patents and collaborations highlight his importance as an inventor. His work continues to shape the future of sound engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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