Michael E Hazen

Title: Michael E Hazen: Innovator in Thermal Modeling for CPUs

Introduction

Michael E Hazen is a notable inventor based in Shrewsbury, MA (US). He has made significant contributions to the field of thermal modeling, particularly in relation to central processing units (CPUs). His innovative approach has led to the development of a unique patent that addresses the challenges of managing heat in integrated circuit components.

Latest Patents

Hazen holds a patent for a "Thermal model for central processing unit." This technique implements a programmable thermal model of an integrated circuit component, such as a CPU and its associated heat sink. The model estimates the die temperature of the component as if there were no cooling devices present in the system. It integrates the thermal energy added when the component is active and the thermal energy removed when it is idle. A programmable power value can represent the heat added to the model at each sample period. The effect of a heat sink in cooling the idle component is modeled by reducing the value of the heat accumulator during each sample period. The decay time constant for the model can be adjusted by changing the sample period. This accurate model allows for the operation of cooling devices, such as fans, only when necessary, thus optimizing energy efficiency.

Career Highlights

Michael E Hazen has worked at Digital Equipment Corporation, where he has applied his expertise in thermal modeling. His work has been instrumental in advancing the understanding of heat management in CPUs, which is critical for enhancing performance and reliability in computing systems.

Collaborations

Hazen has collaborated with notable colleagues, including Reinhard C Schumann and Arnold J Smith. Their combined efforts have contributed to the development of innovative solutions in the field of thermal management.

Conclusion

Michael E Hazen's contributions to thermal modeling for CPUs exemplify the importance of innovation in technology. His patent reflects a significant advancement in managing heat in integrated circuits, showcasing his role as a key inventor in this domain.