Cupertino, CA, United States of America

Michael Danek

USPTO Granted Patents = 2 

Average Co-Inventor Count = 7.5

ph-index = 2

Forward Citations = 88(Granted Patents)


Company Filing History:


Years Active: 2000-2011

where 'Filed Patents' based on already Granted Patents

2 patents (USPTO):

Title: The Innovation Journey of Michael Danek in Semiconductor Technology

Introduction:

Michael Danek, an accomplished inventor based in Cupertino, CA, has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His innovative approach and expertise have paved the way for advancements in thin film deposition and semiconductor wafer construction.

Latest Patents:

1. Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics: This patent showcases Danek's method for forming low resistivity tungsten films with excellent adhesion properties. By utilizing a unique treatment operation and boron-based chemistry, he has successfully deposited films with low resistivity even in high aspect ratio and narrow features.

2. Apparatus for constructing an oxidized film on a semiconductor wafer: Through this patent, Danek introduces a novel approach to constructing films on semiconductor wafers. The in-situ construction process involves material formation followed by oxidation, all within a specialized processing chamber equipped with essential components like a showerhead, wafer support, and rf signal means.

Career Highlights:

Michael Danek has honed his skills and expertise while working at renowned companies such as Novellus Systems Incorporated and Applied Materials, Inc. His tenure at these industry giants has been instrumental in shaping his innovative mindset and pushing the boundaries of semiconductor technology.

Collaborations:

Throughout his career, Danek has collaborated with esteemed colleagues like Anand Chandrashekar and Mirko Glass. Together, they have worked on various projects, sharing insights and expertise to drive innovation in semiconductor processes.

Conclusion:

In conclusion, Michael Danek's relentless pursuit of innovation in semiconductor technology has led to the development of groundbreaking methods for thin film deposition and wafer construction. His patents and collaborations stand as a testament to his dedication and expertise in revolutionizing the industry, making him a respected figure in the field of semiconductor technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…