This inventor holds 1 USPTO granted patent. Top assignee: US Government as Represented by the Secretary of the Army. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Michael D. Dickey and Laser-Folded 3D Electronics.
Introduction
Michael D. Dickey is an inventor associated with Raleigh, North Carolina. His patent work includes a method for shaping printed circuit boards into three-dimensional electronic structures using laser folding.
Latest Patents
Dickey is credited with 1 patent: “Laser Folded 3D Electronics.” The invention describes using a laser to fold a two-dimensional electrically insulating printed circuit board that is at least partially covered with a metal layer. By directing the laser onto the metal layer, the method creates one or more folds, forming a three-dimensional electronic device structure.
Career Highlights
The patent lists the U.S. Government, as represented by the Secretary of the Army, as the assignee. The invention highlights a laser-based approach to forming three-dimensional electronics from printed circuit boards.
Collaborations
Dickey’s listed coworker is Adam L. Bachmann. Their names are associated with the patent record for “Laser Folded 3D Electronics.”
Conclusion
Michael D. Dickey’s patent documents a laser-folding method for transforming a flat, metal-layered circuit board into a three-dimensional electronic structure.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile