Company Filing History:
Years Active: 2003-2007
Title: Michael Cooper: Innovator in RF/IF Circuit Board Technology
Introduction
Michael Cooper is a notable inventor based in Aylmer, Canada. He has made significant contributions to the field of integrated circuit board technology, holding a total of four patents. His innovative designs have paved the way for advancements in radio frequency and intermediate frequency circuit boards.
Latest Patents
One of Michael Cooper's latest patents is a multi-layer integrated RF/IF circuit board that includes a central non-conductive layer. This invention provides a unique fabrication process that begins with a center layer of material, which can either be a rigid core or a pliable non-conductive material. For every layer added to the upper surface of the board's stack-up structure, a corresponding layer of the same material is added to the lower surface. This design ensures that both surfaces are primarily soft and pliable, allowing them to absorb stresses introduced during the lamination process. As a result, the board achieves large area flatness when cooled, and standard manufacturing processes can be utilized for each step in its fabrication. This innovation allows for the inexpensive production of multi-layered integrated RF/IF circuit boards.
Career Highlights
Michael Cooper has established himself as a key player in the technology sector through his work at Dragonwave Inc. His expertise in circuit board design has contributed to the company's reputation for innovation and quality in telecommunications technology.
Collaborations
Michael has collaborated with notable coworkers, including Robert Leroux and Paul Mack, who have also contributed to advancements in the field.
Conclusion
Michael Cooper's work in developing multi-layer integrated RF/IF circuit boards showcases his innovative spirit and dedication to advancing technology. His contributions continue to influence the industry and inspire future innovations.