Dragonwave Inc.

Michael Cooper

Robert Leroux

Paul Mack

A multi-layered integrated RF/IF circuit board is provided. The board is fabricated beginning with a center layer of material. In a first preferred embodiment, the center layer is a rigid core material. In a second preferred embodiment, the center layer is a pliable non-conductive material. For every layer added to the upper surface of the stack-up structure of the board, a corresponding layer of the same material is added to the lower surface of the stack-up structure. Thus, during the lamination process, both the upper and lower surfaces are primarily soft, pliable non-conductive material. These non-conductive layers absorb any stresses introduced during the lamination process. Thus, when cooled, the board has large area flatness. Standard manufacturing processes can be used for each individual step in the fabrication of the board. Therefore, a multi-layered integrated RE/IF circuit board in accordance with the present invention can be fabricated inexpensively.

Multi-layer integrated RF/IF circuit board including a central non-conductive layer

A multi-layered integrated RF/IF circuit board is provided. The board is fabricated beginning with a center layer of material. In a first preferred embodiment, the center layer is a rigid core material. In a second preferred embodiment, the center layer is a pliable non-conductive material. For every layer added to the upper surface of the stack-up structure of the board, a corresponding layer of the same material is added to the lower surface of the stack-up structure. Thus, during the lamination process, both the upper and lower surfaces are primarily soft, pliable non-conductive material. These non-conductive layers absorb any stresses introduced during the lamination process. Thus, when cooled, the board has large area flatness. Standard manufacturing processes can be used for each individual step in the fabrication of the board. Therefore, a multi-layered integrated RF/IF circuit board in accordance with the present invention can be fabricated inexpensively.

Multi-layer integrated RF/IF circuit board

An E-plane filter comprises a housing having a waveguide filter channel and a septum defining a plurality of couplers spaced apart along the length of the filter channel, thereby forming a resonator cavity between each adjacent coupler. The portion of the filter channel which accommodates the couplers and each resonator cavity is curved or otherwise changes direction in a plane transverse to the channel walls.

E-plane filter and a method of forming an E-plane filter

An E-plane waveguide is provided comprising a housing having opposed walls defining a waveguide channel. The waveguide includes at least two elements spaced apart in a direction along the waveguide channel and disposed between and spaced from the opposed walls, and which define a resonant cavity therebetween with the waveguide channel. At least one of the walls has first and second protrusions which are spaced apart in a direction along the waveguide channel and protrude into the waveguide channel. The spacing between the protrusions is less than half a wavelength of the resonant frequency of the resonant cavity.

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Aylmer, Canada

Michael Cooper