Company Filing History:
Years Active: 2005-2013
Title: Michael C Harmes: Innovator in Three-Dimensional Stacked Substrate Arrangements
Introduction
Michael C Harmes is a notable inventor based in North Plains, Oregon. He has made significant contributions to the field of technology, particularly in the area of three-dimensional stacked substrate arrangements. With a total of 5 patents to his name, Harmes has established himself as a key figure in innovation.
Latest Patents
Among his latest patents, Harmes has developed innovative solutions for three-dimensional stacked substrate arrangements. His patents focus on reliable bonding and inter-substrate protection, which are crucial for enhancing the performance and durability of electronic devices. These advancements reflect his commitment to pushing the boundaries of technology.
Career Highlights
Harmes is currently employed at Intel Corporation, a leading technology company known for its cutting-edge innovations. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, further enhancing his expertise and contributions to the field.
Collaborations
Throughout his career, Harmes has worked alongside talented colleagues such as Mauro J Kobrinsky and Sarah E Kim. These collaborations have played a vital role in the development of his patented technologies and have fostered a culture of innovation within his team.
Conclusion
Michael C Harmes is a distinguished inventor whose work in three-dimensional stacked substrate arrangements has made a significant impact on technology. His patents and collaborations reflect his dedication to innovation and excellence in the field.