This inventor holds 3 USPTO granted patents. Top assignees: International Business Machines Corporation, Lockheed Martin Corporation, Loral Federal Systems Company. Active years: 1994-1997.
Company Filing History:
1 out of 166,325 
1 out of 5,319 
1 out of 13 Years Active: 1994-1997
Title: The Innovations of Michael A. Mele
Introduction
Michael A. Mele is a notable inventor based in Endicott, NY (US). He holds a total of 3 patents that showcase his contributions to the field of electronic packaging and protection. His work has significantly impacted the reliability and performance of electronic assemblies.
Latest Patents
One of his latest patents is for a hermetically sealed high-density multi-chip package. This innovative on-board chip package features a hermetically sealed connector that is mechanically secured to a printed wiring board. It is electrically connected to input/output pads on the board. Chip dies are mechanically bonded to the board and individually encapsulated with a suitable potting material. The entire assembly is coated with an encapsulating polymer, which partially overlaps the inboard side of the hermetic connector housing, providing a smooth, crevice-free outer surface. Additionally, the assembly is covered with a metal layer to hermetically seal the entire chip-on-board assembly.
Another significant patent involves a method of manufacturing a flexible metallized polymer film cover. This process provides environmental protection for electronic assemblies, such as circuit card assemblies, which are susceptible to external factors that can impede functional performance and reduce reliability. The use of a two-layer metallized polymer film, with one electrically insulative layer and another metallic layer, ensures both environmental and electrical protection for the enclosed assembly.
Career Highlights
Throughout his career, Michael A. Mele has worked with prominent companies, including Loral Federal Systems Company and IBM. His experience in these organizations has allowed him to develop and refine his innovative ideas in electronic packaging.
Collaborations
Michael has collaborated with notable coworkers such as Patrick M. Scott and Andrew Zachary Glovatsky. Their combined expertise has contributed to the successful development of various projects and patents.
Conclusion
Michael A. Mele's contributions to the field of electronic packaging through his patents demonstrate his innovative spirit and dedication to enhancing the reliability of electronic assemblies. His work continues to influence the industry and inspire future innovations.