Michael A Hoffman

Title: Michael A. Hoffman: Innovator in High-Speed Memory Packaging

Introduction

Michael A. Hoffman is a notable inventor based in San Diego, CA. He has made significant contributions to the field of computer systems through his innovative patent. His work focuses on enhancing memory packaging schemes, which are crucial for high-speed computing.

Latest Patents

Hoffman's most recent patent is titled "High Speed Memory Packaging Scheme." This invention presents a memory packaging scheme designed for high-speed computer systems. It includes several memory module sockets mounted to a printed circuit board, interconnected by a common set of address, data, and control transmission lines. The design allows for the installation of memory modules, such as SIMM memory modules, in sequence according to the computer system's requirements. This innovative approach effectively eliminates undesirable transmission line effects within the printed circuit board.

Career Highlights

Michael A. Hoffman is currently associated with NCR Corporation, where he continues to apply his expertise in memory systems. His work has led to advancements that improve the efficiency and performance of computer memory systems.

Collaborations

Throughout his career, Hoffman has collaborated with talented individuals such as Ikuo J. Sanwo and Hyung S. Kim. These collaborations have contributed to the development of innovative solutions in the field of memory technology.

Conclusion

Michael A. Hoffman is a distinguished inventor whose contributions to high-speed memory packaging have made a significant impact on computer technology. His innovative patent and ongoing work at NCR Corporation highlight his commitment to advancing the field.