Vossem, Belgium

Mervyn Laycock

This inventor holds 1 USPTO granted patent, plus 1 CIPO patent. Top assignee: Huntsman International LLC. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mervyn Laycock. Retrieved from https://idiyas.com/inventor/mervyn-laycock

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Mervyn Laycock: Innovator in Composite Panel Technology

Introduction

Mervyn Laycock is a notable inventor based in Vossem, Belgium. He has made significant contributions to the field of composite materials, particularly with his innovative patent for a composite panel. His work reflects a commitment to advancing technology in material science.

Latest Patents

Mervyn Laycock holds a patent for a composite panel that features a layer of foamed material with a density of less than 100 kg/m³. This layer is sandwiched between two layers of fiber-reinforced polyisocyanurate material. This invention showcases his expertise in creating lightweight yet durable materials suitable for various applications.

Career Highlights

Laycock is associated with Huntsman International LLC, a company known for its advancements in chemical manufacturing and material science. His role at Huntsman has allowed him to collaborate with other talented professionals in the industry.

Collaborations

Some of Mervyn's coworkers include Jan Christiaan Stevens and Luc Van Essche. Their collective expertise contributes to the innovative environment at Huntsman International LLC.

Conclusion

Mervyn Laycock's contributions to composite panel technology exemplify his innovative spirit and dedication to advancing material science. His patent reflects a significant step forward in the development of lightweight and durable materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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