Company Filing History:
Years Active: 2020-2025
Title: Mengyong Liu: Innovator in Wafer Bonding Technology
Introduction
Mengyong Liu is a prominent inventor based in Wuhan, China. He has made significant contributions to the field of wafer bonding technology, holding a total of 4 patents. His innovative work has implications for various applications in semiconductor manufacturing.
Latest Patents
One of Mengyong Liu's latest patents is a wafer bonding apparatus and method. This apparatus includes a first bearing table designed to hold a first wafer with at least one first alignment mark. It also features a second bearing table, positioned opposite the first, to hold a second wafer with at least one second alignment mark. An alignment component is located on at least one side of the bearing tables, which determines the first and second position parameters of the alignment marks using an optical beam. A mobile component connects the two bearing tables and adjusts their relative positions based on the alignment parameters until they meet a predetermined bonding condition. Finally, a bonding component is responsible for bonding the first wafer to the second wafer.
Another aspect of his patent involves a method for wafer bonding. This method determines the first position parameter of a first alignment mark on a first wafer using an optical beam. It also determines the second position parameter of a second alignment mark on a second wafer, utilizing an optical beam that can transmit through the wafer. The relative position between the two wafers is adjusted according to these parameters until the alignment marks satisfy the bonding condition, leading to the successful bonding of the wafers.
Career Highlights
Mengyong Liu is currently employed at Yangtze Memory Technologies Co., Ltd. His work at this company has allowed him to focus on advancing wafer bonding technologies, which are crucial for the semiconductor industry. His innovative contributions have positioned him as a key figure in this field.
Collaborations
Mengyong Liu has collaborated with notable coworkers, including Wu Liu and Guoliang Chen. Their combined expertise has further enhanced the development of innovative technologies in wafer bonding.
Conclusion
Mengyong Liu's contributions to wafer bonding technology demonstrate his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in wafer bonding, making him a valuable asset to his company and the field at large.