Company Filing History:
Years Active: 2020-2023
Title: Innovations of Inventor Mengying Ma
Introduction
Mengying Ma is a notable inventor based in Shanghai, China. He has made significant contributions to the field of integrated circuit packaging, holding 2 patents that showcase his innovative approach to improving electronic connections.
Latest Patents
One of Mengying Ma's latest patents is titled "Package interface with improved impedance continuity." This invention involves a packaged integrated circuit that includes an integrated circuit chip with a SerDes signal pad and a package substrate featuring a core via. The design aims to enhance connection impedance matching through an arrangement of micro-vias. The method also includes steps to minimize parasitic capacitances and adjust micro-via arrangements for optimal performance.
Another significant patent is "Reflection-canceling package trace design." This technique focuses on providing at least partial cancellation of reflections in high-bandwidth chip-to-chip links. The method involves determining propagation delays for electrical signals traversing substrate traces and setting trace lengths to achieve desired signal integrity.
Career Highlights
Mengying Ma is currently employed at Credo Technology Group Limited, where he continues to develop innovative solutions in the field of electronics. His work has been instrumental in advancing technologies that improve the performance of integrated circuits.
Collaborations
Mengying has collaborated with talented coworkers, including Xike Liu and Xiangxiang Ye, who contribute to the innovative environment at Credo Technology Group Limited.
Conclusion
Mengying Ma's contributions to integrated circuit technology through his patents reflect his commitment to innovation and excellence in the field. His work continues to influence advancements in electronic design and packaging.