This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Jiangnan University. Active years: 2024-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024-2025
Title: Mengwei Zhang - Innovator in Starch-Based Adhesives
Introduction
Mengwei Zhang is a notable inventor based in Wuxi, China. He has made significant contributions to the field of adhesive preparation, particularly focusing on starch-based adhesives for particleboards. His innovative approach addresses critical challenges in adhesive curing times and production efficiency.
Latest Patents
Mengwei Zhang holds a patent for a "High-temperature fast-curing starch-based adhesive for particleboards and preparation method thereof." This invention is designed to enhance the performance of starch-based adhesives by ensuring low viscosity through the selection of a specific crosslinking monomer. The adhesive is capable of curing quickly at high temperatures, significantly reducing the curing time to approximately 60 seconds. This advancement not only improves the thermosetting properties and water resistance of the adhesive but also boosts the overall production efficiency of particleboards.
Career Highlights
Mengwei Zhang is affiliated with Jiangnan University, where he continues to engage in research and development in the field of adhesives. His work has garnered attention for its practical applications in the manufacturing industry, particularly in the production of particleboards.
Collaborations
Mengwei Zhang collaborates with esteemed colleagues such as Li Cheng and Zhengbiao Gu. Their combined expertise contributes to the advancement of adhesive technologies and the exploration of new materials.
Conclusion
Mengwei Zhang's innovative work in developing fast-curing starch-based adhesives represents a significant leap forward in adhesive technology. His contributions not only address existing challenges but also pave the way for more efficient manufacturing processes in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile