This inventor holds 1 USPTO granted patent. Top assignees: Beijing Boe Display Technology Co., Ltd., Beijing Boe Technology Development Co., Ltd.. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2022
Title: Mengmeng Lu: Innovator in Packaging Technology
Introduction
Mengmeng Lu is a prominent inventor based in Beijing, China. She has made significant contributions to the field of packaging technology, particularly in electronic devices. Her innovative approach has led to the development of a unique packaging method that enhances the functionality and efficiency of electronic devices.
Latest Patents
Mengmeng Lu holds a patent for a packaging method, electronic device, and packaging apparatus. The patent describes a process that involves providing a first substrate and a second substrate. The method includes cell-assembling these substrates to sandwich a filling glue between them, which is mixed with an electrophoretic liquid encapsulated by a capsule. This innovative approach allows for the controlled movement of electrophoretic particles within the capsule, enhancing the overall performance of the packaging structure.
Career Highlights
Throughout her career, Mengmeng Lu has worked with notable companies such as Beijing BOE Display Technology Co., Ltd. and Beijing BOE Technology Development Co., Ltd. Her experience in these organizations has allowed her to refine her skills and contribute to advancements in display technology and packaging solutions.
Collaborations
Mengmeng has collaborated with talented individuals in her field, including Sha Feng and Bo Zhou. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
Mengmeng Lu is a trailblazer in the realm of packaging technology, with a focus on electronic devices. Her patent and career achievements reflect her dedication to innovation and her impact on the industry. Her work continues to inspire future advancements in packaging methods.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile