This inventor holds 1 USPTO granted patent and 3 published patent applications and 1 EPO patent. Top assignee: Huazhong University of Science and Technology. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Mengfan Li - Innovator in Semiconductor Technology
Introduction
Mengfan Li is an accomplished inventor based in Hefei, China. He is currently associated with Changxin Memory Technologies, Inc., where he contributes to advancements in semiconductor technology. Despite having no granted patents to his name, his work in the field is noteworthy.
Latest Patent Applications
Mengfan Li has filed a patent application titled "PACKAGE STRUCTURE, PACKAGING METHOD AND SEMICONDUCTOR DEVICE." This application outlines a package structure, a packaging method, and a semiconductor device. The method includes providing a semiconductor functional structure with an interconnecting layer on its surface. It also describes forming an isolation layer that exposes part of the interconnecting layer, which acts as a first pad for conducting a first type test. After completing this test, a redistribution layer is formed on the first pad and the isolation layer, ensuring electrical connectivity. Finally, a first insulating layer is created, exposing parts of the redistribution layer that serve as second and third pads for further testing and functional interactions.
Conclusion
Mengfan Li's contributions to semiconductor technology, particularly through his latest patent application, highlight his innovative approach in the field. His work at Changxin Memory Technologies, Inc. positions him as a significant figure in advancing semiconductor solutions.