Company Filing History:
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1 out of 1 Years Active: 2022
Title: Mengdan Wang: Innovator in Dielectric Substrate Integrated Filters
Introduction
Mengdan Wang is a notable inventor based in Zhangye, China. He has made significant contributions to the field of dielectric substrate integrated filters, showcasing his innovative spirit and technical expertise. His work focuses on enhancing the performance and cost-effectiveness of these filters, which are essential in various electronic applications.
Latest Patents
Mengdan Wang holds a patent for a "Balanced-type strip-shaped dielectric substrate integrated filter." This invention includes a high-k dielectric substrate, with first and second low-k dielectric substrates and metal grounds symmetrically stacked on its upper and lower surfaces. The design proposes a high Q-value strip-shaped dielectric substrate integrated resonator that operates in TM mode. It employs strip-shaped dielectric blocks with double grooves, combined with air groove structures, to address the high costs and self-packaging challenges of existing balanced-type dielectric filters. This innovation results in a balanced-type strip-shaped dielectric substrate integrated filter characterized by low loss, self-packaging capabilities, high integration levels, and reduced costs.
Career Highlights
Mengdan Wang has worked at Nantong University and the Nantong Research Institute for Advanced Communication and Technology. His experience in these institutions has allowed him to collaborate with other experts in the field and further his research in dielectric materials and integrated filters.
Collaborations
Some of his notable coworkers include Kai Xu and Jin Shi. Their collaborative efforts have contributed to the advancement of technology in the field of dielectric substrates.
Conclusion
Mengdan Wang's innovative work in dielectric substrate integrated filters demonstrates his commitment to advancing technology in this area. His contributions not only enhance the performance of electronic devices but also address cost and packaging challenges. His patent reflects a significant step forward in the field, showcasing the potential for future innovations.