The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 2022
Filed:
Jun. 14, 2022
Nantong University, Nantong, CN;
Nantong Research Institute for Advanced Communication Technologies Ltd., Nantong, CN;
Kai Xu, Nantong, CN;
Mengdan Wang, Zhangye, CN;
Jin Shi, Nantong, CN;
Rong Cai, Nantong, CN;
Wei Zhang, Nantong, CN;
Lingyan Zhang, Yongzhou, CN;
NANTONG UNIVERSITY, Nantong, CN;
NANTONG RESEARCH INST. FOR ADVANCED COMM. & TECH., Nantong, CN;
Abstract
A balanced-type strip-shaped dielectric substrate integrated filter includes: a high-k dielectric substrate; and first low-k dielectric substrates, second low-k dielectric substrates and metal grounds are symmetrically stacked on upper and lower surfaces of the high-k dielectric substrate. Compared with an existing balanced-type dielectric filter, a high Q-value strip-shaped dielectric substrate integrated resonator with a packageable characteristic which works in TMmode and employs strip-shaped dielectric blocks with double grooves, combined with air groove structures of upper and lower layers and a packaging substrate is proposed, so that problems that cost is high and self-packaging cannot be realized of the existing balanced-type dielectric filter when being implemented by combining ceramic dielectric with a metal chamber structure can be solved, and thereby a balanced-type strip-shaped dielectric substrate integrated filter with the characteristic of low loss is realized; and meanwhile the filter may have advantages of self-packaging, high integration level and low cost.