Taipei, Taiwan

Meng-Ying Chuang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Industrial Technology Research Institute. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng-Ying Chuang. Retrieved from https://idiyas.com/inventor/meng-ying-chuang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: The Innovations of Meng-Ying Chuang

Introduction

Meng-Ying Chuang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of adhesive technology. His innovative approach has led to the development of a unique adhesive structure that enhances bonding capabilities.

Latest Patents

Meng-Ying Chuang holds a patent for an "Adhesive structure with hybrid adhesive layer." This invention includes a first layer, a second layer, and a hybrid adhesive layer that adheres the two layers together. The hybrid adhesive layer consists of two or more adhesive units made from different materials, arranged in a planar pattern. This design allows for improved adhesion and versatility in various applications.

Career Highlights

Meng-Ying Chuang is affiliated with the Industrial Technology Research Institute, where he has been instrumental in advancing adhesive technologies. His work has garnered attention for its practical applications in various industries.

Collaborations

Some of his notable coworkers include Kuo-Feng Chen and Chih-Chia Chang. Their collaborative efforts contribute to the innovative environment at the Industrial Technology Research Institute.

Conclusion

Meng-Ying Chuang's contributions to adhesive technology exemplify the impact of innovation in enhancing product performance. His patent reflects a significant advancement in adhesive structures, showcasing his expertise and dedication to the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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