Hsinchu Science Park, Taiwan

Meng-Yen Tsai


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations of Meng-Yen Tsai in Plasma Technology

Introduction

Meng-Yen Tsai is a notable inventor based in Hsinchu Science Park, Taiwan. He has made significant contributions to the field of plasma technology, particularly in the development of systems for thin film deposition. His innovative work has led to the creation of a unique plasma enhanced atomic layer deposition (PEALD) system.

Latest Patents

Meng-Yen Tsai holds 1 patent for his invention of a plasma enhanced atomic layer deposition system. This system is designed to form thin films on substrates and includes a plasma chamber, a processing chamber, two or more ring units, and a control piece. The plasma chamber consists of outer and inner quartz tubular units, which are aligned to concentrate plasma in an annular space. This design allows for a more even distribution of plasma flow across the substrate, resulting in uniformly distributed thin films and nanoparticles. The alignment of the through holes in the chamber enables precise control over the plasma's entry into the processing chamber, preventing unwanted chemical vapor deposition (CVD) reactions.

Career Highlights

Meng-Yen Tsai is affiliated with the National Applied Research Laboratories, where he continues to advance research in plasma technology. His work has been instrumental in enhancing the efficiency and effectiveness of thin film deposition processes.

Collaborations

Meng-Yen Tsai collaborates with talented colleagues, including Bo-Heng Liu and Chi-Chung Kei, who contribute to the innovative research environment at the National Applied Research Laboratories.

Conclusion

Meng-Yen Tsai's contributions to plasma technology through his patented PEALD system exemplify the importance of innovation in the field of materials science. His work not only advances technological capabilities but also paves the way for future developments in thin film applications.

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