Meng-Tsung Kuo

Title: Innovations of Meng-Tsung Kuo

Introduction

Meng-Tsung Kuo is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative work has led to the development of a unique chip package structure that enhances performance and reliability.

Latest Patents

Meng-Tsung Kuo holds 1 patent for his invention titled "Structure and formation method of chip package with protective lid." This patent describes a package structure and a formation method that includes disposing a chip structure over a substrate. The method involves forming a first adhesive element directly on the chip structure, which has a specific thermal conductivity. Additionally, a second adhesive element is formed on the chip structure, possessing a greater thermal conductivity than the first. The protective lid is then attached to the chip structure through both adhesive elements, ensuring optimal protection and performance.

Career Highlights

Meng-Tsung Kuo is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this prestigious company has allowed him to focus on advancing chip packaging technologies. His contributions have been instrumental in improving the efficiency and effectiveness of semiconductor devices.

Collaborations

Meng-Tsung Kuo has collaborated with esteemed colleagues such as Hui-Chang Yu and Chih-Kung Huang. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Meng-Tsung Kuo's innovative work in semiconductor packaging exemplifies the importance of advancements in technology. His patent and contributions to Taiwan Semiconductor Manufacturing Company Limited highlight his role as a key figure in the industry.