Shenzhen, China

Meng Lin

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Aac Acoustic Technologies (Shenzhen) Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng Lin. Retrieved from https://idiyas.com/inventor/meng-lin-1zu30hs2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Meng Lin: Inventor of an Enhanced Speaker Module and Smart Headset.

Introduction

Meng Lin is an inventor based in Shenzhen, China. He is associated with AAC Acoustic Technologies (Shenzhen) Co., Ltd. His patent portfolio includes 1 patent.

Latest Patents

Lin’s patent, “Speaker Module and Smart Headset,” describes a speaker module with a housing that contains two spaces and two sounding units. Each unit divides its space into a front sound cavity and a rear sound cavity. Two speaker holes on the same surface of the housing allow the units’ sound outputs to supplement and combine with one another, with the stated aim of improving the speaker’s frequency range and loudness.

Career Highlights

The available information identifies Lin as an inventor working in Shenzhen and associates him with AAC Acoustic Technologies (Shenzhen) Co., Ltd. His patent focuses on speaker and headset acoustics.

Collaborations

The patent’s subject matter connects Lin’s inventive work with AAC Acoustic Technologies (Shenzhen) Co., Ltd. The available details do not specify additional collaborators.

Conclusion

Meng Lin’s patent presents a dual-unit speaker design intended to enhance sound output in a speaker module and smart headset.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…