Hsinchu, Taiwan

Meng Hsuan Wu

This inventor holds 3 USPTO granted patents. Top assignee: M31 Technology Corporation. Active years: 2022-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng Hsuan Wu. Retrieved from https://idiyas.com/inventor/meng-hsuan-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022-2024

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3 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Meng Hsuan Wu

Introduction: Meng Hsuan Wu, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Wu's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced processing capabilities.

Career Highlights: With a background in electrical engineering, Wu has worked for several leading tech companies in Taiwan, honing his skills and expertise in semiconductor design. His career highlights include spearheading the development of a revolutionary chip architecture that has set new standards in the industry.

Collaborations: Wu has collaborated with top research institutions in Taiwan, such as the Industrial Technology Research Institute (ITRI), to further his research and bring his innovative ideas to life. His partnerships with industry experts have led to the successful implementation of his inventions in real-world applications.

Conclusion: Meng Hsuan Wu's passion for innovation and his relentless pursuit of technological advancement have solidified his reputation as a visionary inventor in the field of semiconductor technology. His contributions continue to shape the future of the industry, inspiring the next generation of inventors to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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