Meng-Chun Lee

Title: Innovations of Meng-Chun Lee

Introduction

Meng-Chun Lee is an accomplished inventor based in Emeryville, California. He has made significant contributions to the field of adhesive technology, particularly in the development of advanced adhesive conductive films.

Latest Patents

Meng-Chun Lee holds a patent for "Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes." This innovative adhesive conductive film (ACF) comprises a substrate and a layer of adhesive on its surface. The adhesive may contain conductive particles dispersed within it. The invention features at least one tier of conductive particles arranged in a non-random array, formed by transferring conductive particles from a carrier belt to the adhesive layer. Notably, the portion of the tier corresponding to the stitching line is free of conductive particles. The adhesive layer can also be overcoated with a second tier of conductive particles arranged in a non-random array, particularly in the area corresponding to the stitching line. This design allows for the presence of more than two tiers of conductive particles within the ACF.

Career Highlights

Meng-Chun Lee is currently employed at Trillion Science, Inc., where he continues to innovate in the field of adhesive technologies. His work has led to advancements that enhance the performance and reliability of adhesive conductive films.

Collaborations

Throughout his career, Meng-Chun Lee has collaborated with notable colleagues, including Rong-Chang Liang and Jane Sun. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Meng-Chun Lee's innovative work in adhesive conductive films showcases his expertise and commitment to advancing technology in this field. His contributions are significant and continue to impact the industry positively.