Shanghai, China

Melvin T Zin

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: 3M Innovative Properties Company. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Melvin T Zin. Retrieved from https://idiyas.com/inventor/melvin-t-zin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Melvin T. Zin: Innovator in Advanced Materials

Introduction

Melvin T. Zin is a notable inventor based in Shanghai, China. He has made significant contributions to the field of advanced materials, particularly in applications that require durability and resistance to extreme conditions.

Latest Patents

Melvin T. Zin holds 1 patent for an innovative article and method of making and using the same. His patent describes an article that features a first single, discrete atomic, dry layer of a first weakly bonded crystalline material on at least a surface of a substrate. This technology is particularly useful for automotive under-the-hood parts that are exposed to chemicals and extreme temperatures.

Career Highlights

Zin is currently associated with 3M Innovative Properties Company, where he continues to develop cutting-edge materials that enhance product performance and longevity. His work is instrumental in advancing the capabilities of materials used in various industries.

Collaborations

Throughout his career, Melvin has collaborated with talented individuals such as Boon Kiat Lim and Ranjith Divigalpitiya. These partnerships have fostered innovation and contributed to the success of their projects.

Conclusion

Melvin T. Zin's contributions to the field of advanced materials exemplify the impact of innovative thinking in engineering. His work not only enhances product performance but also paves the way for future advancements in material science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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