Company Filing History:
Years Active: 1998
Title: The Innovative Contributions of Melvin Desilva
Introduction
Melvin Desilva is a notable inventor based in Dallas, Texas, recognized for his significant contributions to the field of semiconductor technology. He holds a patent that showcases his expertise in electroless copper deposition methods, which are crucial for forming interconnects in semiconductor devices. His innovative approach has implications for enhancing the performance and reliability of electronic components.
Latest Patents
Melvin Desilva's patent, titled "Protected encapsulation of catalytic layer for electroless copper," presents a method for utilizing electroless copper deposition to create interconnects on semiconductors. The process begins with the formation of a via or trench in a dielectric layer, followed by the deposition of a titanium nitride (TiN) or tantalum (Ta) barrier layer. A catalytic copper seed layer is then conformally deposited in a vacuum over the barrier layer. Without breaking the vacuum, an aluminum protective layer is added to encapsulate the catalytic layer, preventing oxidation. The electroless deposition technique is employed to deposit copper on the catalytic layer, which continues until the via or trench is filled. The process concludes with chemical-mechanical polishing (CMP) to remove excess material, ensuring that only the necessary copper and barrier material remain in the openings.
Career Highlights
Throughout his career, Melvin Desilva has worked with prominent organizations, including the Cornell Research Foundation Inc. and Intel Corporation. His experience in these esteemed companies has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.
Collaborations
Melvin has collaborated with esteemed colleagues such as Yosef Schacham-Diamand and Valery M Dubin, further enhancing the impact of his work in the field.
Conclusion
Melvin Desilva's innovative patent and career achievements highlight his significant role in advancing semiconductor technology. His contributions continue to influence the industry and pave the way for future innovations.