Chu-Pei, Taiwan

Mei-Ling Chu

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Union Technology Corporation. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mei-Ling Chu. Retrieved from https://idiyas.com/inventor/mei-ling-chu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Innovations of Mei-Ling Chu

Introduction

Mei-Ling Chu is a notable inventor based in Chupei, Taiwan. She has made significant contributions to the field of resin compositions, showcasing her expertise and innovative spirit. Her work has led to the development of a unique resin composition that has various applications.

Latest Patents

Mei-Ling Chu holds a patent for a resin composition and its uses. This resin composition includes an epoxy resin and a hardener, with the hardener's amount ranging from about 10 parts by weight to about 200 parts by weight per 100 parts by weight of the epoxy resin. The hardener consists of a first styrene-maleic anhydride copolymer and a second SMA copolymer, with specific molar ratios that enhance its properties.

Career Highlights

Mei-Ling Chu is currently employed at Taiwan Union Technology Corporation, where she continues to innovate and develop new materials. Her work has been instrumental in advancing the applications of resin compositions in various industries.

Collaborations

Mei-Ling has collaborated with talented coworkers, including Hsien-Te Chen and Tsung-Hsien Lin, contributing to a dynamic and innovative work environment.

Conclusion

Mei-Ling Chu's contributions to resin technology exemplify her dedication to innovation and her impact on the industry. Her patent reflects her commitment to advancing material science and her role as a leading inventor in her field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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