Company Filing History:
Years Active: 2017
Title: Innovations by Mei-Chin Chang
Introduction
Mei-Chin Chang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of circuit board technology. His innovative approach has led to the development of a unique patent that enhances the manufacturing process of circuit boards.
Latest Patents
Mei-Chin Chang holds a patent for a circuit board and its manufacturing method. The patent describes a circuit board that includes a substrate, a patterned copper layer, a phosphorous-containing electroless plating palladium layer, an electroless plating palladium layer, and an immersion plating gold layer. The patterned copper layer is disposed on the substrate, while the phosphorous-containing electroless plating palladium layer is placed on the patterned copper layer. This layer contains a weight percentage of phosphorous ranging from 4% to 6%, and a weight percentage of palladium from 94% to 96%. The electroless plating palladium layer, which is positioned on the phosphorous-containing layer, has a weight percentage of palladium of 99% or more. Finally, the immersion plating gold layer is applied on top of the electroless plating palladium layer.
Career Highlights
Mei-Chin Chang is currently associated with Subtron Technology Co., Ltd. His work at this company has allowed him to focus on advancing circuit board technology. His innovative designs and methods have positioned him as a key player in the industry.
Collaborations
Mei-Chin Chang has collaborated with several talented individuals, including Chin-Sheng Wang and Ching-Sheng Chen. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Mei-Chin Chang's contributions to circuit board technology through his patent demonstrate his commitment to innovation. His work continues to influence the industry and inspire future advancements.