Company Filing History:
Years Active: 2014-2017
Title: Mayuko Nishihara: Innovator in Bonded Structures and Electronic Components
Introduction
Mayuko Nishihara is an inventor based in Nagaokakyo-shi, Japan. He has made significant contributions to the field of bonded structures and electronic components. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
1. **Bonded Structure, Method for Producing Same, Conductive Member for Solder Bonding, and Structure for Solder Bonding**
This application describes a bonded structure that includes a first conductive member, a second conductive member, and a solder-bonded part for bonding the two members. At least one of the conductive members contains a metal and particles with one or more layers.
2. **Electronic Component Module and Manufacturing Method Therefor**
This application outlines an electronic component module that features a substrate with a first electrode pattern and a first resist pattern. A first electronic component is mounted on the substrate, and a component-embedding resin layer is provided to embed the electronic component. The design includes an interlayer connection conductor that connects the electrode pattern to an external connection electrode pattern.
Conclusion
Mayuko Nishihara's work in developing bonded structures and electronic components showcases his innovative spirit and dedication to advancing technology. His latest patent applications reflect his commitment to creating effective solutions in the field.