The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2014

Filed:

Feb. 23, 2012
Applicants:

Masashi Arai, Nagaokakyo, JP;

Mayuko Nishihara, Nagaokakyo, JP;

Inventors:

Masashi Arai, Nagaokakyo, JP;

Mayuko Nishihara, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/50 (2006.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H05K 1/18 (2006.01); H01L 25/065 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/49827 (2013.01); H01L 23/50 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H05K 1/186 (2013.01); H01L 25/0652 (2013.01); H01L 2924/09701 (2013.01); H05K 3/4069 (2013.01); H05K 3/4652 (2013.01); H05K 3/4673 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09481 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/0191 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A resin multilayer substrate includes a component-containing layer and a thin resin layer stacked on a surface of the component-containing layer. The resin multilayer substrate further includes a surface electrode located on a surface opposite to the surface of the thin resin layer stacked on the component-containing layer, a first via conductor provided in the component-containing layer, which includes an end reaching one surface of the component-containing layer, and a second via conductor provided in the thin resin layer, which includes a first end electrically connected to the surface electrode and a second end electrically connected to the via conductor. A portion of the thin resin layer in contact with the second via conductor defines a projection projecting into the first via conductor.


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