Cambridge, United Kingdom

Max Penfold

This inventor holds 1 USPTO granted patent. Top assignee: Bicc Plc. Active years: 1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Max Penfold. Retrieved from https://idiyas.com/inventor/max-penfold

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: Max Penfold - Innovator in Optical Fiber Technology

Introduction

Max Penfold is a notable inventor based in Cambridge, GB. He has made significant contributions to the field of optical fiber technology. His innovative work has led to the development of a unique patent that enhances the efficiency of optical fiber splicing.

Latest Patents

Max Penfold holds a patent for an optical fiber splicing apparatus. This composite apparatus is designed for preparing and positioning the tails of two optical fibers for fusion splicing. The invention includes optical fiber cleaving apparatus, mechanically controlled fusion splicing apparatus, optical fiber holding devices, and associated transfer arms. Additionally, it features a low voltage power source that is electrically connected to the high voltage circuitry of the splicing apparatus via a flexible electric cable. The design allows for the transfer of a holding device from one operating station to another, ensuring precise alignment of the optical fiber tails during the splicing process.

Career Highlights

Max Penfold is associated with Bicc Plc, where he has applied his expertise in optical fiber technology. His work has been instrumental in advancing the capabilities of fiber optic systems, which are crucial for modern telecommunications.

Collaborations

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Conclusion

Max Penfold's contributions to optical fiber technology through his innovative patent demonstrate his commitment to advancing the field. His work continues to influence the development of efficient splicing techniques in telecommunications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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