Max Li-Hua Wang

Title: Max Li-Hua Wang: Innovator in Wireless Charging and RF-Acoustic Technology

Introduction

Max Li-Hua Wang is a prominent inventor based in Stanford, California. He has made significant contributions to the fields of wireless charging and RF-acoustic technology. With a total of 2 patents, Wang's innovations are paving the way for advancements in efficient power transfer systems.

Latest Patents

Wang's latest patents include a radiative wireless charging system and an RF-ultrasound relay for efficient power and data transfer across interfaces. The radiative wireless charging system features a transmitter antenna array, detectors, sensors, and processors that work together to focus electromagnetic waves on receiver antennas. This technology allows for the efficient transmission of power while ensuring safety by stopping power transmission when a person is detected within the near-field range. The RF-ultrasound relay provides a hybrid solution where some RF power is rectified to power the relay, while the remaining power drives an acoustic transceiver array. This innovation enables effective communication and power delivery to acoustically powered nodes, even in challenging environments.

Career Highlights

Throughout his career, Wang has worked with esteemed organizations such as Leland Stanford Junior University and Google Inc. His experience in these institutions has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in his field.

Collaborations

Wang has collaborated with notable colleagues, including Mohammad Amin Arbabian and Chun-Ming Ernest So. These partnerships have fostered a creative environment that has led to groundbreaking inventions and advancements.

Conclusion

Max Li-Hua Wang is a visionary inventor whose work in wireless charging and RF-acoustic technology is shaping the future of power transfer systems. His contributions are not only innovative but also essential for the development of safer and more efficient technologies.