Munich, Germany

Max Langhof

This inventor holds 1 USPTO granted patent. Top assignee: Brainlab Se. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Max Langhof. Retrieved from https://idiyas.com/inventor/max-langhof

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Max Langhof: Advancing Patient-Specific Biomechanical Modeling.

Introduction

Max Langhof is an inventor based in Munich, Germany. His patent work concerns computer-implemented methods for predicting how parts of a patient’s body deform, supporting applications in medical planning and systems.

Latest Patents

Langhof is associated with 1 patent: “Biomechanical Model for Predicting Deformations of a Patient Body.” The invention describes a method that uses a computer-simulatable biomechanical model and multiple forward simulations to calculate deformation vectors. It then builds an approximated model, incorporates pre-operative data, and optimizes a predicted deformation before applying that deformation to the patient data. The disclosed approaches include multivariate interpolation and mode decomposition.

Career Highlights

Langhof works at Brainlab SE, a medical technology company. His patent reflects work at the intersection of computational modeling and medical applications, with a focus on predicting patient-body deformation.

Collaborations

Langhof’s coworker Danas Sutula is identified as a collaborator in the information provided. The patent description also situates the work within a medical-system context.

Conclusion

Max Langhof’s patent focuses on using biomechanical simulation and computational methods to predict patient-body deformation, connecting his work at Brainlab SE with medical technology innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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