Munich, Germany

Max Ceburkov

This inventor holds 1 USPTO granted patent. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Max Ceburkov. Retrieved from https://idiyas.com/inventor/max-ceburkov

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Max Ceburkov

Introduction

Max Ceburkov is a notable inventor based in Munich, Germany. He has made significant contributions to the field of innovation, particularly with his unique invention of a cup cover. His work exemplifies the spirit of creativity and problem-solving that drives the world of inventions.

Latest Patents

Max Ceburkov holds a patent for his innovative cup cover. This invention addresses practical needs and showcases his ability to create functional solutions. With 1 patent to his name, Ceburkov is a testament to the impact that even a single invention can have.

Career Highlights

Throughout his career, Ceburkov has demonstrated a commitment to innovation. His work has not only contributed to his personal achievements but has also inspired others in the field. His dedication to improving everyday items reflects a deep understanding of user needs.

Collaborations

Ceburkov has collaborated with talented individuals such as Ferdinand Schütze and Nick Tränkle. These partnerships have enriched his work and expanded the scope of his inventions. Collaboration is often key in the innovation process, and Ceburkov's experience highlights this aspect.

Conclusion

Max Ceburkov's journey as an inventor showcases the importance of creativity and collaboration in the world of innovation. His contributions, particularly the cup cover, serve as a reminder of the potential impact of inventive thinking.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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