Matthias Schultz

Title: Matthias Schultz: Innovator in Electroplating Technology

Introduction

Matthias Schultz is a notable inventor based in Jena, Germany. He has made significant contributions to the field of electroplating, particularly in the development of processes and compositions that enhance the manufacturing of printed circuit boards.

Latest Patents

Schultz holds a patent for an innovative electroplating process and composition. This invention relates to a metal sulfide dispersion that is utilized for electroplating nonconductors, such as substrates used in the formation of printed circuit boards. The patented technology allows for the creation of metallized through-holes that feature electrodeposited copper on the walls, with an adsorbed layer of metal sulfide particles positioned between the circuit board base material and the copper. The metal sulfide is characterized by spherical particles with a mean diameter of less than 100 nanometers, ensuring a high-quality electroplating process.

Career Highlights

Matthias Schultz is currently associated with Shipley Company, L.L.C., where he continues to innovate in the field of electroplating. His work has been instrumental in advancing technologies that improve the efficiency and effectiveness of printed circuit board manufacturing.

Collaborations

Throughout his career, Schultz has collaborated with esteemed colleagues, including Egon Matijevic and Wade W Sonnenberg. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Matthias Schultz is a pioneering inventor whose work in electroplating technology has made a significant impact on the manufacturing of printed circuit boards. His contributions continue to influence the industry and pave the way for future advancements.