San Francisco, CA, United States of America

Matthew Zaverl

This inventor holds 1 USPTO granted patent. Top assignee: Apple Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Matthew Zaverl. Retrieved from https://idiyas.com/inventor/matthew-zaverl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 18.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations by Matthew Zaverl in Headphone Technology

Introduction

Matthew Zaverl is an innovative inventor based in San Francisco, CA. He has made significant contributions to the field of audio technology, particularly in headphone design. His work focuses on enhancing user experience through improved acoustic structures.

Latest Patents

One of Matthew Zaverl's notable patents is for a headphone earcup structure. This invention includes a frame that defines a cavity designed to surround the ear of a user. It features a damping component coupled to the frame, encircling the cavity. Additionally, a wrap component covers the damping component and defines a continuous acoustic opening around the cavity, allowing for an acoustic connection to the damping component. Finally, a cosmetic component covers the wrap component and the continuous acoustic opening, enhancing the overall aesthetic of the headphone.

Career Highlights

Matthew Zaverl is currently employed at Apple Inc., where he continues to innovate in the audio technology sector. His work at such a prestigious company highlights his expertise and commitment to advancing headphone technology.

Collaborations

Matthew has collaborated with talented individuals such as Jarrett B Lagler and Michael B Minerbi, contributing to a dynamic work environment that fosters creativity and innovation.

Conclusion

Matthew Zaverl's contributions to headphone technology exemplify his dedication to improving user experience through innovative design. His patent for a headphone earcup structure showcases his ability to blend functionality with aesthetics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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