Matthew T Pickett

Title: Matthew T. Pickett: Innovator in Thermosetting Coating Technology

Introduction

Matthew T. Pickett is a notable inventor based in Bognor Regis, GB. He has made significant contributions to the field of thermosetting materials, particularly in the area of extrusion coating technology. His innovative approach has led to advancements that enhance the efficiency and effectiveness of coating processes.

Latest Patents

Matthew T. Pickett holds a patent for a "Method for co-reactive extrusion coating of pipe using thermosetting." This method involves the co-reactive slot die extrusion coating of elongated tubular articles, such as pipes. The process includes extruding a two-component thermosetting material through a specially designed slot die made of low friction material. This design allows for rapid opening of the die, facilitating the easy removal of gelled material by hand. The method significantly increases coverage rates and allows for the use of interchangeable and reusable slot dies. In a preferred embodiment, the extrusion step utilizes a slot die made of two blocks of acetal resin, which can be quickly unclamped for convenient removal of the gelled thermoset material.

Career Highlights

Matthew T. Pickett is associated with W. R. Grace Co.-Conn., where he has applied his expertise in thermosetting materials. His work has contributed to the development of innovative solutions in the field of extrusion coating, showcasing his commitment to advancing technology in this area.

Collaborations

Matthew has collaborated with Cung Vu, further enhancing the innovative efforts within his field. Their partnership exemplifies the importance of teamwork in driving technological advancements.

Conclusion

Matthew T. Pickett's contributions to thermosetting coating technology demonstrate his innovative spirit and dedication to improving industrial processes. His patent reflects a significant advancement in the field, showcasing the potential for increased efficiency and effectiveness in coating applications.