Atlanta, GA, United States of America

Matthew Smith

This inventor holds 1 USPTO granted patent. Top assignee: Tcpoly Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Matthew Smith. Retrieved from https://idiyas.com/inventor/matthew-smith-rzimc216

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Matthew Smith

Introduction

Matthew Smith is an accomplished inventor based in Atlanta, GA. He has made significant strides in the field of 3D printing technology. His innovative approach has led to the development of a unique device that enhances the efficiency of 3D printing processes.

Latest Patents

Matthew holds a patent for a "Device and method for cutting a continuous fiber 3D printing filament." This device features a blade with a cutting end and a drive end, designed to cut filament effectively. The blade is supported by a mechanism that allows it to move relative to the heater block of the 3D printer, ensuring precise cuts. This invention is particularly valuable for improving the workflow in 3D printing applications.

Career Highlights

Matthew is currently employed at Tcpoly Inc., where he continues to innovate and contribute to advancements in 3D printing technology. His work has garnered attention for its practical applications and potential to streamline production processes.

Collaborations

Matthew collaborates with talented individuals such as Andrew Myers and Thomas Lloyd Bougher. Together, they work on various projects that push the boundaries of 3D printing technology.

Conclusion

Matthew Smith's contributions to the field of 3D printing are noteworthy and demonstrate his commitment to innovation. His patent for a cutting device exemplifies his ability to solve practical problems in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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