Company Filing History:
Years Active: 2006
Title: The Innovations of Matthew E Doty
Introduction
Matthew E Doty is an accomplished inventor based in Phoenix, AZ. He has made significant contributions to the field of semiconductor packaging through his innovative patent. His work focuses on creating hermetic seals that enhance the reliability and performance of semiconductor devices.
Latest Patents
Matthew E Doty holds a patent for a hermetic seal that involves ultrasonically formed seals, their use in semiconductor packages, and methods of fabricating these packages. The patent describes a brittle center member, such as glass, which has a molded edge member. This edge member is ultrasonically welded to a body made of ultrasonically weldable materials. The resulting hermetically sealed semiconductor package includes a lid with a brittle center plate and a molded edge that is securely attached to the body. The design incorporates locating features for accurate positioning and energy directors, as well as pins that can be hermetically sealed to the body.
Career Highlights
Matthew E Doty is currently employed at Silicon Bandwidth, Inc., where he continues to develop innovative solutions in semiconductor technology. His expertise in ultrasonically welded seals has positioned him as a key player in the industry.
Collaborations
Throughout his career, Matthew has collaborated with notable colleagues, including Stanford W Crane, Jr. and Myoung-soo Jeon. These partnerships have contributed to the advancement of technology in semiconductor packaging.
Conclusion
Matthew E Doty's contributions to the field of semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology. His work continues to influence the industry and improve the reliability of semiconductor devices.