This inventor holds 1 USPTO granted patent. Top assignee: Degussa Aktiengesellschaft. Active years: 1990.
Company Filing History:
Years Active: 1990
Title: The Innovations of Mathias Metzner
Introduction
Mathias Metzner is a notable inventor based in Kleinostheim, Germany. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique solder paste that enhances the reliability of semiconductor attachments.
Latest Patents
Mathias Metzner holds a patent for a solder paste designed for fastening semiconductors onto ceramic bases. This solder paste operates effectively in a temperature range below 380°C. The composition includes 75 to 90% by weight of a mixture of silver powder and low-melting glass powder, with a specific weight ratio of silver to glass. Additionally, it contains 10 to 25% by weight of an organic solvent that incorporates a thermally decomposable resin. The glass powder is primarily composed of lead oxide, boron oxide, silver (I) oxide, and bismuth (III) oxide, among other components. This innovative formulation ensures optimal performance in semiconductor applications.
Career Highlights
Mathias Metzner is associated with Degussa Aktiengesellschaft, a company known for its advancements in materials science. His work has been instrumental in developing solutions that meet the demands of modern electronics. With a focus on quality and performance, he has contributed to the company's reputation as a leader in the industry.
Collaborations
Throughout his career, Mathias has collaborated with esteemed colleagues such as Wolfgang Weber and Karl-Anton Starz. These partnerships have fostered an environment of innovation and creativity, leading to advancements in their respective fields.
Conclusion
Mathias Metzner's contributions to semiconductor technology through his patented solder paste exemplify his commitment to innovation. His work continues to influence the industry, showcasing the importance of research and development in advancing technology.