Company Filing History:
Years Active: 2007
Title: Masuo Kondo: Innovator in Solder Ball Technology
Introduction: Masuo Kondo is a notable inventor based in Ibaraki, Japan. He has made significant contributions to the field of materials science, particularly in the development of solder ball technology. His innovative approach has led to the creation of a unique method for producing solder balls that enhance the reliability of electronic components.
Latest Patents: Kondo holds a patent for a method of making a solder ball. This solder ball features a spherical core wrapped in a solder layer composed of tin (Sn) and silver (Ag). The invention is characterized by its low moisture content, with the solder layer containing 100 µl/g or less of water when measured under standard conditions. This innovation is crucial for improving the performance and longevity of electronic devices.
Career Highlights: Kondo is currently employed at Neomax Material Co., Ltd., where he continues to advance his research and development efforts. His work has been instrumental in enhancing the quality and efficiency of solder materials used in various electronic applications.
Collaborations: Kondo collaborates with Fumiaki Kikui, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the exploration of new ideas and technologies.
Conclusion: Masuo Kondo's contributions to solder ball technology exemplify the impact of innovation in the electronics industry. His patented method not only improves product reliability but also showcases the importance of research and collaboration in driving technological advancements.