The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2007
Filed:
Sep. 24, 2003
Applicants:
Masuo Kondo, Ibaraki, JP;
Fumiaki Kikui, Osaka, JP;
Inventors:
Masuo Kondo, Ibaraki, JP;
Fumiaki Kikui, Osaka, JP;
Assignee:
Neomax Material Co., Ltd., Osaka, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A solder ballaccording to the present invention includes a spherical coreand a solder layer, which includes Sn and Ag and which is provided so as to wrap the coreup. The amount of water contained in the solder layeris 100 μl/g or less when represented by the amount of water vapor in standard conditions.
Kondo, Masuo. (2007). Method of making a solder ball (U.S. Patent No. 7265046). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7265046
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile