Matsudo, Japan

Masumi Takahashi

This inventor holds 3 USPTO granted patents, plus 1 CIPO patent. Top assignee: Kohjin Co., Ltd.. Active years: 1992-1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masumi Takahashi. Retrieved from https://idiyas.com/inventor/masumi-takahashi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 1.8

ph-index = 3

Forward Citations = 42(Granted Patents)


Company Filing History:


Years Active: 1992-1996

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3 patents (USPTO):Explore Patents

Title: Masumi Takahashi: Innovator in Packaging Technology

Introduction

Masumi Takahashi is a prominent inventor based in Matsudo, Japan. She has made significant contributions to the field of packaging technology, holding a total of three patents. Her innovative work has had a considerable impact on the industry, particularly in the development of efficient packaging methods.

Latest Patents

Among her latest patents are a heat-seal package and method of packaging, as well as a biaxially stretched polyethylene film. These inventions showcase her expertise in creating advanced packaging solutions that enhance product preservation and usability.

Career Highlights

Masumi Takahashi is currently employed at Kohjin Co., Ltd., where she continues to push the boundaries of packaging technology. Her work at the company has been instrumental in developing new methods that improve the efficiency and effectiveness of packaging processes.

Collaborations

Throughout her career, Masumi has collaborated with notable colleagues, including Hideo Isozaki and Makoto Hirata. These partnerships have allowed her to expand her knowledge and contribute to innovative projects within the industry.

Conclusion

Masumi Takahashi is a trailblazer in the field of packaging technology, with a strong portfolio of patents and a commitment to innovation. Her contributions continue to shape the future of packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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