Masayuki Ohsawa

Title: Masayuki Ohsawa: Innovator in Microelectronics

Introduction

Masayuki Ohsawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of microelectronics, holding a total of 6 patents. His innovative methods have advanced the manufacturing processes of microelectronic assemblies and wiring circuit substrates.

Latest Patents

Ohsawa's latest patents include a method of making microelectronic assemblies. This method involves providing a conductive metal layer with a first and second surface, etching the first surface to create conductive protrusions, and ensuring that the second surface remains flat. Additionally, he has developed a manufacturing method for wiring circuit substrates. This method includes creating a connection component with a metal layer, forming openings in a dielectric layer, and plating conductive protrusions that interconnect electrically.

Career Highlights

Throughout his career, Ohsawa has worked with notable companies such as North Corporation and Tessera Interconnect Materials, Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in microelectronics.

Collaborations

One of his notable collaborators is Tomoo Iijima, with whom he has worked on various projects in the field.

Conclusion

Masayuki Ohsawa's contributions to microelectronics through his innovative patents and career achievements highlight his importance in the industry. His work continues to influence the development of advanced technologies in this field.