Company Filing History:
Years Active: 2024
Title: Masaya Yumiba: Innovator in Composite Substrate Technology
Introduction
Masaya Yumiba is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of materials science, particularly in the development of composite substrates. His innovative work has led to the filing of a patent that showcases his expertise and creativity in this area.
Latest Patents
Masaya Yumiba holds a patent for a composite substrate and method for manufacturing the same, as well as a circuit substrate and method for manufacturing the same. The patent describes a composite substrate that includes, in this order: a ceramic plate, a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy, and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy. Additionally, an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer. This innovative design enhances the performance and durability of the substrates.
Career Highlights
Masaya Yumiba is currently employed at Denka Company Limited, where he continues to push the boundaries of material innovation. His work at Denka has allowed him to collaborate with other talented professionals in the field, further enhancing his contributions to technology.
Collaborations
Masaya has worked alongside notable colleagues such as Atsushi Sakai and Kentaro Nakayama. Their collaborative efforts have fostered an environment of innovation and creativity, leading to advancements in substrate technology.
Conclusion
Masaya Yumiba's contributions to the field of composite substrates exemplify the spirit of innovation. His patent and ongoing work at Denka Company Limited highlight his commitment to advancing technology in materials science.