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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11973002 B1

PDFFull Text
Date of Patent:
Apr. 30, 2024

Filed:

Nov. 12, 2020

Composite substrate and method for manufacturing same, and circuit substrate and method for manufacturing same

Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Atsushi Sakai, Tokyo, JP;

Masaya Yumiba, Tokyo, JP;

Kentaro Nakayama, Tokyo, JP;

Yoshitaka Taniguchi, Tokyo, JP;

Assignee:

Denka Company Limited, Tokyo, JP;

Attorney:

Leydig, Voit & Mayer, Ltd.

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
H01L 23/373 (2006.01); C23C 4/073 (2016.01); C23C 4/08 (2016.01); C23C 4/18 (2006.01); C23C 28/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); C23C 4/073 (2016.01); C23C 4/08 (2013.01); C23C 4/18 (2013.01); C23C 28/321 (2013.01); H01L 21/4857 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32227 (2013.01);
Abstract

A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

Find Patent Forward Citations

Sakai, Atsushi. (2024). Composite substrate and method for manufacturing same, and circuit substrate and method for manufacturing same (U.S. Patent No. 11973002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11973002

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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