The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2024
Filed:
Nov. 12, 2020
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Atsushi Sakai, Tokyo, JP;
Masaya Yumiba, Tokyo, JP;
Kentaro Nakayama, Tokyo, JP;
Yoshitaka Taniguchi, Tokyo, JP;
Assignee:
Denka Company Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); C23C 4/073 (2016.01); C23C 4/08 (2016.01); C23C 4/18 (2006.01); C23C 28/00 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); C23C 4/073 (2016.01); C23C 4/08 (2013.01); C23C 4/18 (2013.01); C23C 28/321 (2013.01); H01L 21/4857 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32227 (2013.01);
Abstract
A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.