This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Sumitomo Bakelite Company Limited. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Masaya Koda: Innovator in Semiconductor Encapsulation
Introduction
Masaya Koda is a distinguished inventor located in Tokyo, Japan. His contributions to the field of semiconductor technology are encapsulated in his innovative patent, which addresses key challenges in the industry. With a focus on improving workability and reliability in semiconductor devices, Koda's work is a testament to ongoing advancements in materials science.
Latest Patents
Koda holds a notable patent titled "Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same." This patent details an encapsulation resin composition that comprises an epoxy resin and a curing agent with flux activity. The unique properties of this composition allow for improved tack after B-staging and controlled melt viscosity. The innovations outlined in this patent ensure that the resin composition is less susceptible to air entrapment during the provisional placement of semiconductor chips, highlighting its significance for enhanced workability and reliability.
Career Highlights
He is currently associated with Sumitomo Bakelite Company Limited, where he applies his expertise in developing advanced materials for semiconductor applications. Koda's career is marked by his commitment to pushing the boundaries of technology in the semiconductor industry, showcasing his role as a pivotal innovator in this sector.
Collaborations
Throughout his career, Koda has collaborated with several talented colleagues at Sumitomo Bakelite Company Limited, including Satoru Katsurayama and Yushi Sakamoto. These collaborations reflect a shared vision of innovation and excellence within the team, as they work together to enhance semiconductor technologies and contribute to industry advancements.
Conclusion
Masaya Koda's contributions to the field of semiconductor encapsulation demonstrate the importance of innovation in driving technological progress. His patent not only represents a significant advancement in materials science but also serves as a foundation for future developments in semiconductor device fabrication. As Koda continues to work alongside his esteemed colleagues, the semiconductor industry can look forward to further breakthroughs that will shape its future.