This inventor holds 1 USPTO granted patent. Top assignee: Komatsu Corporation. Active years: 1999.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1999
Title: Masato Suwa: Innovator in IC Package Processing
Introduction
Masato Suwa is a notable inventor based in Hiratsuka, Japan. He has made significant contributions to the field of integrated circuit (IC) packaging. His innovative work has led to the development of a unique patent that enhances the efficiency of IC package processing.
Latest Patents
Masato Suwa holds a patent for an "IC package processing and measuring method and system therefor." This invention addresses critical challenges in the IC packaging industry, providing a systematic approach to processing and measuring IC packages effectively. He has 1 patent to his name, showcasing his expertise and commitment to innovation.
Career Highlights
Suwa is currently employed at Komatsu Corporation, a leading company known for its advanced technology and engineering solutions. His role at Komatsu allows him to apply his inventive skills in a practical setting, contributing to the company's reputation for innovation in the industry.
Collaborations
Throughout his career, Masato Suwa has collaborated with talented individuals such as Yukihiro Tsuda and Masashi Ichihara. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Masato Suwa is a distinguished inventor whose work in IC package processing has made a significant impact in the field. His contributions, along with his collaborations, continue to drive innovation at Komatsu Corporation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile