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For the Inventor, By the Inventor

Tokyo, Japan

Masato Ohtsuka

This inventor holds 2 USPTO granted patents. Top assignee: Hoya Corporation. Active years: 2005-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masato Ohtsuka. Retrieved from https://idiyas.com/inventor/masato-ohtsuka-aekhtmhe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 28(Granted Patents)


Company Filing History:

goldMedal2 out of 2,569 
 
Hoya Corporation
 patents

Years Active: 2005-2008

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2 patents (USPTO):Explore Patents
1. 7455785 - Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus (2008-11-25),
2. 6951502 - METHOD OF DETERMINING A FLATNESS OF AN ELECTRONIC DEVICE SUBSTRATE, METHOD OF PRODUCING THE SUBSTRATE, METHOD OF PRODUCING A MASK BLANK, METHOD OF PRODUCING A TRANSFER MASK, POLISHING METHOD, ELECTRONIC DEVICE SUBSTRATE, MASK BLANK, TRANSFER MASK, AND POLISHING APPARATUS (2005-10-04),

Title: **Masato Ohtsuka: Innovator in Substrate Flatness Technologies**

Introduction

Masato Ohtsuka, based in Tokyo, Japan, is an accomplished inventor who has contributed significantly to the field of electronic device substrates. With two patents to his name, Ohtsuka is recognized for his innovative methods and technologies that enhance the performance of electronic devices through improved substrate flatness.

Latest Patents

Masato Ohtsuka's latest patents focus on various techniques for determining and producing electronic device substrates, as well as associated polishing methods and apparatus. His inventions include a method for determining the flatness of an electronic device substrate, a method for producing the substrate, and techniques related to mask blanks and transfer masks. Notably, these patents involve predicting the variation in flatness resulting from film stress in thin films applied to the substrates. The process includes measuring the substrate's flatness, selecting an appropriate load type, and polishing under specified pressure distributions to achieve a flatness ranging between greater than 0 µm and not exceeding 0.25 µm. The innovations introduced by Ohtsuka aim to significantly improve the quality and consistency of electronic components.

Career Highlights

As an inventor at Hoya Corporation, Masato Ohtsuka has played a vital role in advancing substrate technology. His work has enabled the creation of high-quality substrates essential for the functionality of various electronic devices. His patents not only reflect his technical expertise but also demonstrate his commitment to enhancing product performance through innovative solutions.

Collaborations

Throughout his career, Ohtsuka has collaborated with notable professionals such as Kesahiro Koike and Yasutaka Tochihara. These collaborations have fostered an environment of innovation, allowing Ohtsuka to refine his techniques and push the boundaries of substrate technology further.

Conclusion

Masato Ohtsuka’s contributions to the invention and refinement of electronic device substrates are significant in the realm of technology. His innovative methodologies for determining flatness and enhancing the production of substrates are crucial for the ongoing evolution of electronic devices. As he continues to develop new solutions, Ohtsuka remains a key figure in the field of substrate innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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