Location History:
- Shiso-gun, JP (2005 - 2008)
- Hyogo-ken, JP (2010)
Company Filing History:
Years Active: 2005-2010
Title: Masataka Nanba: Innovator in Semiconductor Technology
Introduction
Masataka Nanba is a prominent inventor based in Shiso-gun, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on innovative methods and equipment for manufacturing semiconductor devices.
Latest Patents
Masataka Nanba's latest patents include groundbreaking inventions such as ultrasonic bonding equipment for manufacturing semiconductor devices and methods related to these devices. The ultrasonic bonding equipment features a tip portion designed to propagate ultrasonic vibrations to a surface that is to be bonded. This equipment includes multiple protruding portions, each with specific surface inclinations to enhance bonding efficiency. Additionally, his semiconductor device patent describes a structure that includes a semiconductor chip, a lead, and a bonding strap that electrically connects the chip and lead. This design incorporates a recess on the bonding strap to improve connectivity and performance.
Career Highlights
Masataka Nanba is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work at Toshiba has allowed him to develop and refine his innovative ideas, contributing to advancements in semiconductor manufacturing processes.
Collaborations
Masataka has collaborated with notable colleagues such as Norihide Funato and Hiroshi Sawano. Their teamwork has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the semiconductor field.
Conclusion
Masataka Nanba's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the future of semiconductor manufacturing.